K5-PRO Viscous Thermal Paste for pad replacement (60g pack)
K5-PRO is a high-quality viscous heat-transfer paste designed to replace soft thermal pads on various components. It offers improved thermal conductivity and easy application, though some users note messiness; one customer mentions long-lasting adhesion
Highlights
- high thermal conductivity
- non-electrical conductivity
- wide operating temp range
Pros
- high thermal conductivity 5.3 W/m.K
- easy direct application on components
- suitable for VRMs and VRAMs replacement
- long-lasting adhesion (as noted by user)
Cons
- messiness during use
- mixed opinions on temperature control performance
Best For
Features
- Viscous heat paste replacing soft heat pads in memory ICs and components
- Thermal conductivity > 5.3 W/m·K, at least 3x higher than typical pads
- Direct application to components with no electrical conductivity
- Operating temperature range from -90 to 250 C
- No expiry date; storage in a closed tin; made in Greece; compatible with iMac and Asus ROG