K5-PRO 110g viscous thermal paste for memory chips and pads
K5-PRO is a gummy thermal paste designed to replace soft thermal pads on memory chips and components. It offers high thermal conductivity and easy direct-apply use, with mixed user feedback on temperature performance
Highlights
- non-conductive formulation
- high thermal conductivity
- easy direct-application
Pros
- high thermal conductivity (K > 5.3 W/m·K)
- easy direct-apply on components
- non-conductive electrical properties
- operational temp range -90 to 250 C
- compatible with various gaming laptops and consoles
Cons
- mixed user experiences on temperature performance
- some users report it doesn't outperform pads
Best For
Features
- Gummy/sticky thermal paste for memory chips and similar components replacing soft pads
- Fills gaps up to 3mm, effective up to 1mm pad thickness
- Thermal conductivity K>5.3 W/m·K with non-conductive electrical properties
- Operational range from -90 to 250°C, easy direct application
- Compatible with Apple iMac, Asus ROG, and various gaming laptops and consoles