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340 Silicone Heat Sink Compound for thermal coupling

HushOil ★ 3.4/5 · ItemOracle Score Mid-Range

$40 USD
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340 Silicone Heat Sink Compound 5oz 142g (Dow Corning 340 Non Flowing) Suitable for Thermal Coupling of Electrical Devices and PCB Assemblies to Heat Sinks, Compliant with MIL-DTL-47113

Silicone heat sink compound for thermal coupling of electrical devices and PCB assemblies to heat sinks. Non-flowing, non-curing, low bleed, MIL-DTL-47113 compliant. Customer feedback mentions neutral sentiment about performance

Highlights

  • MIL-DTL-47113 compliance
  • non-flowing + non-curing
  • low bleed silicone compound

Pros

  • non-flowing formulation
  • non-curing
  • low bleed
  • MIL-DTL-47113 compliant
  • suitable for heat sink coupling

Cons

  • limited customer sentiment data
  • only 7 reviews available
  • no explicit performance metrics provided

Best For

  • thermal coupling for electrical devices
  • PCB assemblies to heat sinks
  • thermal management in electronics
  • silicone adhesive-like gap filler (non-structural)

Features

  • MIL-DTL-47113 compliant 340 silicone heat sink compound
  • Non-flowing, non-curing formulation for stable GAP filling
  • Moderate thermal conductivity with low bleed characteristics
  • No oven or curing required for assembly
  • Facilitates heat transfer away from circuitry to improve reliability

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