K5-PRO Viscous Thermal Paste for pad replacement (60g pack) vs GP-Ultimate Thermal Pad 120x120x3.0mm - Gelid Solutions
Overall winner: GP-Ultimate Thermal Pad 120x120x3.0mm - Gelid Solutions
Key Differences
Gelid (Product A) is a solid thermal pad with very high thermal conductivity (15 W/mK), a large 120x120x3.0mm form factor and non-electrical/non-corrosive properties—good for straightforward gap filling. CS Labs (Product B) is a viscous thermal paste alternative (5.3 W/mK) intended to replace pads for direct application to VRMs/VRAMs but is messier to apply and has mixed temperature-control feedback
K5-PRO Viscous Thermal Paste for pad replacement (60g pack)
K5-PRO is a high-quality viscous heat-transfer paste designed to replace soft thermal pads on various components. It offers improved thermal conductivity and easy application, though some users note messiness; one customer mentions long-lasting adhesion
Pros
- high thermal conductivity 5.3 W/m.K
- easy direct application on components
- suitable for VRMs and VRAMs replacement
- long-lasting adhesion (as noted by user)
Cons
- messiness during use
- mixed opinions on temperature control performance
GP-Ultimate Thermal Pad 120x120x3.0mm - Gelid Solutions
Thermal pad with 15W/mK conductivity for gap filling and easy installation. Helps lower VRM/GPU temps, non-electrical and non-toxic
Pros
- high thermal conductivity (15W/mK)
- easy to install with 120x120mm size
- non-electrical, non-corrosive, non-toxic
- good customer-reported temperature improvement
Cons
- mixed opinions on sturdiness
- varying value for money perceptions
Head-to-Head
| Criteria | Winner |
|---|---|
| Price | CS Labs |
| Durability | Gelid Solutions |
| Versatility | Gelid Solutions |
| User Reviews | Gelid Solutions |